A ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits. BGA packages are used to permanently mount devices such as microprocessors.
In a BGA the pins are replaced by pads on the bottom of the package, each initially with a tiny ball of solder stuck to it. These solder spheres can be placed manually or by automated equipment, and are held in place with a tacky flux. The performance of BGAs depends on the quality of these solder balls. However, once the package is soldered into place, it is difficult to find soldering faults. X-ray and CT machines are a great choice to perform these types of inspections.
METLAB used its NSI X-View M5000-CT machine to measure the solder balls on a number of different BGAs, using x-ray images and a post processing software. Results would help our customer to determine the possible failure causes or improve the performance of their manufactured product.